32M-bit NOR Flash memory with parallel interface, featuring 70ns maximum access time and 3.3V typical operating voltage. This surface-mount component utilizes a Thin Fine Pitch Ball Grid Array (TFBGA) package with 63 pins, measuring 11mm x 7mm x 0.9mm (Max) with a 0.8mm pin pitch. It offers asymmetrical block organization, sectored architecture, and supports 4M x 8 or 2M x 16 word configurations, with a bottom boot block. Operating current is a maximum of 10mA, with programming voltages ranging from 2.7 to 3.6V and 11.5 to 12.5V, and an operating temperature range of -40°C to 85°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron M29DW324DB70ZA6 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 63 |
| PCB | 63 |
| Package Length (mm) | 11 |
| Package Width (mm) | 7 |
| Package Height (mm) | 0.9(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 10mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|11.5 to 12.5V |
| Timing Type | Asynchronous |
| Maximum Access Time | 70ns |
| Number of Words | 4M/2M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 22/21bit |
| Location of Boot Block | Bottom |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Micron M29DW324DB70ZA6 Datasheet
Download the complete datasheet for Micron M29DW324DB70ZA6 to view detailed technical specifications.
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