PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron M29DW324DB90ZA6T technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
63
PCB
63
Package Length (mm)
11
Package Width (mm)
7
Package Height (mm)
0.9(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Micron M29DW324DB90ZA6T Datasheet
Download the complete datasheet for Micron M29DW324DB90ZA6T to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.