64M-bit NOR Flash memory with parallel interface, offering 70ns maximum access time. Features asymmetrical, sectored block organization with boot block capability at the bottom or top. Operates at 3.3V typical supply voltage and supports 8M x 8 or 4M x 16 word configurations. Packaged in a 48-pin TSOP (Thin Small Outline Package) for surface mounting, with a plastic lead-frame SMT construction. Suitable for operation between -40°C and 85°C.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron M29DW640D70N6T technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSOP |
| Package Description | Thin Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 12 |
| Package Width (mm) | 18.4 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 64Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 10mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|12V |
| Timing Type | Asynchronous |
| Maximum Access Time | 70ns |
| Number of Words | 8M/4M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 23/22bit |
| Location of Boot Block | Bottom|Top |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Micron M29DW640D70N6T Datasheet
Download the complete datasheet for Micron M29DW640D70N6T to view detailed technical specifications.
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