64M-bit NOR Flash memory with a parallel interface, operating at 3.3V. Features 8M x 8 or 4M x 16 word organization and a maximum access time of 90ns. This surface-mount component utilizes a 63-pin Thin Fine Pitch Ball Grid Array (TFBGA) package with a 0.8mm pin pitch. Supports asymmetrical block organization and sectored architecture, with boot blocks located at the bottom or top. Operates across a temperature range of -40°C to 85°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron M29DW640D90ZA6T technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
63
PCB
63
Package Length (mm)
11
Package Width (mm)
7
Package Height (mm)
0.9(Max)
Seated Plane Height (mm)
0.9(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
64Mbit
Interface Type
Parallel
Maximum Operating Current
10mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6|12V
Timing Type
Asynchronous
Maximum Access Time
90ns
Number of Words
8M/4M
Boot Block
Yes
Typical Operating Supply Voltage
3.3V
Address Bus Width
23/22bit
Location of Boot Block
Bottom|Top
Number of Bits per Word
8/16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron M29DW640D90ZA6T Datasheet
Download the complete datasheet for Micron M29DW640D90ZA6T to view detailed technical specifications.
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