2M-bit NOR Flash memory with parallel interface, featuring 256K words x 8 bits organization. Operates from 4.5 to 5.5 V with a maximum access time of 55 ns. This surface-mount component utilizes a 32-pin PLCC package (Plastic Leaded Chip Carrier) with J-lead configuration and a pin pitch of 1.27 mm. Includes a bottom boot block and supports an 18-bit address bus, functioning across an industrial temperature range of -40 °C to 125 °C.
PackagePLCC
MountingSurface Mount
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Technical Specifications
Micron M29F002BNB55K3 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
LCC
Package/Case
PLCC
Package Description
Plastic Leaded Chip Carrier
Lead Shape
J-Lead
Pin Count
32
PCB
32
Package Length (mm)
14.1(Max)
Package Width (mm)
11.56(Max)
Package Height (mm)
3.18(Max)
Seated Plane Height (mm)
3.56(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-016AE
Density
2Mbit
Interface Type
Parallel
Maximum Operating Current
15mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
4.5 to 5.5V
Timing Type
Asynchronous
Maximum Access Time
55ns
Number of Words
256K
Boot Block
Yes
Typical Operating Supply Voltage
5V
Address Bus Width
18bit
Location of Boot Block
Bottom
Number of Bits per Word
8bit
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron M29F002BNB55K3 Datasheet
Download the complete datasheet for Micron M29F002BNB55K3 to view detailed technical specifications.
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