2M-bit NOR Flash memory with a parallel interface, featuring 70ns maximum access time and 256K x 8 organization. This component operates from a 4.5 to 5.5V programming voltage and a typical 5V supply. It is housed in a 32-pin TSOP (Thin Small Outline Package) with gull-wing leads for surface mounting. The memory architecture is sectored with an asymmetrical block organization and includes a bottom boot block. Operating across a temperature range of -40°C to 125°C, it offers an 18-bit address bus and an 8-bit data bus.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron M29F002BNB70P3T technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
32
PCB
32
Package Length (mm)
8.1(Max)
Package Width (mm)
18.5(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
2Mbit
Interface Type
Parallel
Maximum Operating Current
15mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
4.5 to 5.5V
Timing Type
Asynchronous
Maximum Access Time
70ns
Number of Words
256K
Boot Block
Yes
Typical Operating Supply Voltage
5V
Address Bus Width
18bit
Location of Boot Block
Bottom
Number of Bits per Word
8bit
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron M29F002BNB70P3T Datasheet
Download the complete datasheet for Micron M29F002BNB70P3T to view detailed technical specifications.
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