2M-bit NOR Flash memory with a parallel interface, featuring a 50ns maximum access time. This integrated circuit offers 256K x 8 or 128K x 16 organization and supports an 18/17-bit address bus. Designed for surface mounting, it utilizes a 48-pin TSOP package with gull-wing leads and operates from a 4.5 to 5.5V programming voltage, with a typical 5V supply. The memory architecture is sectored with a bottom boot block, suitable for operation between 0°C and 70°C.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron M29F200BB50N1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12
Package Width (mm)
18.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
2Mbit
Interface Type
Parallel
Maximum Operating Current
20mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
4.5 to 5.5V
Timing Type
Asynchronous
Maximum Access Time
50ns
Number of Words
256K/128K
Boot Block
Yes
Typical Operating Supply Voltage
5V
Address Bus Width
18/17bit
Location of Boot Block
Bottom
Number of Bits per Word
8/16bit
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron M29F200BB50N1 Datasheet
Download the complete datasheet for Micron M29F200BB50N1 to view detailed technical specifications.
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