4M-bit NOR Flash memory with a parallel interface, offering 512K x 8 organization and 90ns maximum access time. This component operates from a 3.3V supply and features asynchronous timing. It is housed in a 40-pin TSOP (Thin Small Outline Package) with gull-wing leads, designed for surface mounting. The memory architecture is sectored with an asymmetrical block organization and includes a bottom boot block. Operating temperature range is 0°C to 70°C.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron M29W004BB90N1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
40
PCB
40
Package Length (mm)
10.1(Max)
Package Width (mm)
18.5(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-142CD
Density
4Mbit
Interface Type
Parallel
Maximum Operating Current
10mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6V
Timing Type
Asynchronous
Maximum Access Time
90ns
Number of Words
512K
Boot Block
Yes
Typical Operating Supply Voltage
3.3V
Address Bus Width
19bit
Location of Boot Block
Bottom
Number of Bits per Word
8bit
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Micron M29W004BB90N1 Datasheet
Download the complete datasheet for Micron M29W004BB90N1 to view detailed technical specifications.
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