256M-bit NOR Flash memory with parallel interface, offering 32M x 8 or 16M x 16 word configurations. Features a 60ns maximum access time and supports 3V/3.3V typical operating voltages, with programming voltages ranging from 2.7-3.6V and 11.5-12.5V. This surface-mount component utilizes a 64-pin TFBGA package with a 1mm pin pitch, measuring 13mm x 10mm x 0.8mm. Includes boot block capability with bottom/top location options and operates within a 0°C to 70°C temperature range.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron M29W256GL60ZA1F technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 13 |
| Package Width (mm) | 10 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 256Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 10mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|11.5 to 12.5V |
| Timing Type | Asynchronous |
| Maximum Access Time | 60ns |
| Number of Words | 32M/16M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 25/24bit |
| Location of Boot Block | Bottom|Top |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Micron M29W256GL60ZA1F Datasheet
Download the complete datasheet for Micron M29W256GL60ZA1F to view detailed technical specifications.
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