64M-bit NOR Flash memory with parallel interface, featuring 8M x 8 or 4M x 16 word organization and 70ns maximum access time. This surface-mount component utilizes a 64-pin FBGA package with a 1mm pin pitch, offering 23/22 bit address bus width and 8/16 bit words per address. Operates from 3V/3.3V typical supply voltage with a maximum operating current of 10mA, and supports programming voltages from 2.7-3.6V or 11.5-12.5V. Designed for a temperature range of -40°C to 85°C.
PackageFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Micron M29W640GH70ZS6F technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 13 |
| Package Width (mm) | 11 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 64Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 10mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|11.5 to 12.5V |
| Timing Type | Asynchronous |
| Maximum Access Time | 70ns |
| Number of Words | 8M/4M |
| Boot Block | No |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 23/22bit |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Micron M29W640GH70ZS6F Datasheet
Download the complete datasheet for Micron M29W640GH70ZS6F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.