64M-bit NOR Flash memory with a parallel interface, offering 4M x 16 organization. Features a 120ns maximum access time and operates from a typical 3.3V supply, with programming voltages ranging from 2.7-3.6V and 11.5-12.5V. This surface-mount component is housed in a 63-pin TFBGA package with a 0.8mm pin pitch, measuring 11mm x 7mm x 0.9mm (Max). Designed for a -40°C to 85°C operating temperature range, it draws a maximum of 10mA.
PackageTFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Micron M29W641DH12ZA6E technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 63 |
| PCB | 63 |
| Package Length (mm) | 11 |
| Package Width (mm) | 7 |
| Package Height (mm) | 0.9(Max) |
| Seated Plane Height (mm) | 0.9(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 64Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 10mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|11.5 to 12.5V |
| Timing Type | Asynchronous |
| Maximum Access Time | 120ns |
| Number of Words | 4M |
| Boot Block | No |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 22bit |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micron M29W641DH12ZA6E Datasheet
Download the complete datasheet for Micron M29W641DH12ZA6E to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.