16M-bit NOR Flash memory with a parallel interface, featuring 512K words x 32 bits. This component offers a maximum access time of 90 ns and operates from a typical 3.3V supply, with programming voltages ranging from 2.7 to 3.6V and 11.4 to 12.6V. The LBGA package is a low-profile ball grid array with 80 pins, measuring 12mm x 10mm x 1.1mm, designed for surface mounting. It supports asymmetrical block organization, sectored architecture, and includes a bottom boot block. Operating current is a maximum of 30 mA, with an operating temperature range of -40°C to 85°C.
PackageLBGA
MountingSurface Mount
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Technical Specifications
Micron M58BW016BB90ZA6 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LBGA |
| Package Description | Low Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 80 |
| PCB | 80 |
| Package Length (mm) | 12 |
| Package Width (mm) | 10 |
| Package Height (mm) | 1.1 |
| Seated Plane Height (mm) | 1.1 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 16Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 30mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|11.4 to 12.6V |
| Timing Type | Asynchronous|Synchronous |
| Maximum Access Time | 90ns |
| Number of Words | 512K |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 19bit |
| Location of Boot Block | Bottom |
| Number of Bits per Word | 32bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micron M58BW016BB90ZA6 Datasheet
Download the complete datasheet for Micron M58BW016BB90ZA6 to view detailed technical specifications.
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