32M-bit NOR Flash memory with parallel and serial interface, featuring a 1M x 32 word organization and 55ns maximum access time. This surface-mount component utilizes a low-profile 80-pin LBGA package (12x10x1.1mm) with a 1mm pin pitch. Operating at 3.3V, it offers asymmetrical sectored architecture with a boot block located at the bottom. Designed for automotive applications, it functions across a -40°C to 125°C temperature range with a maximum operating current of 50mA.
PackageLBGA
MountingSurface Mount
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Technical Specifications
Micron M58BW032BB55ZA3 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LBGA
Package Description
Low Profile Ball Grid Array
Lead Shape
Ball
Pin Count
80
PCB
80
Package Length (mm)
12
Package Width (mm)
10
Package Height (mm)
1.1
Seated Plane Height (mm)
1.7(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
32Mbit
Interface Type
Parallel|Serial
Maximum Operating Current
50mA
Block Organization
Asymmetrical
Architecture
Sectored
Timing Type
Asynchronous|Synchronous
Maximum Access Time
55ns
Number of Words
1M
Boot Block
Yes
Typical Operating Supply Voltage
3.3V
Address Bus Width
20bit
Location of Boot Block
Bottom
Number of Bits per Word
32bit
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron M58BW032BB55ZA3 Datasheet
Download the complete datasheet for Micron M58BW032BB55ZA3 to view detailed technical specifications.
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