32M-bit NOR Flash memory with 1M x 32 organization, featuring parallel and serial interfaces. Operates at 3.3V with a maximum access time of 55ns. This surface-mount component is housed in an 80-pin LBGA package (12x10x1.1mm) with a 1mm pin pitch. Includes boot block functionality with asymmetrical block organization and a 20-bit address bus. Suitable for operation between -40°C and 85°C.
PackageLBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Micron M58BW032DB55ZA6 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LBGA
Package Description
Low Profile Ball Grid Array
Lead Shape
Ball
Pin Count
80
PCB
80
Package Length (mm)
12
Package Width (mm)
10
Package Height (mm)
1.1
Seated Plane Height (mm)
1.7(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
32Mbit
Interface Type
Parallel|Serial
Maximum Operating Current
50mA
Block Organization
Asymmetrical
Architecture
Sectored
Timing Type
Asynchronous|Synchronous
Maximum Access Time
55ns
Number of Words
1M
Boot Block
Yes
Typical Operating Supply Voltage
3.3V
Address Bus Width
20bit
Location of Boot Block
Bottom
Number of Bits per Word
32bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron M58BW032DB55ZA6 Datasheet
Download the complete datasheet for Micron M58BW032DB55ZA6 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.