32M-bit NOR Flash memory with parallel and serial interface, featuring 1M x 32 organization and 55ns maximum access time. This surface-mount component operates at 3.3V, offering asynchronous and synchronous timing with a 20-bit address bus. Housed in an 80-pin LBGA package (12x10x1.1mm), it supports boot block functionality and operates across a -40°C to 85°C temperature range.
PackageLBGA
MountingSurface Mount
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Technical Specifications
Micron M58BW032DB55ZA6T technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LBGA |
| Package Description | Low Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 80 |
| PCB | 80 |
| Package Length (mm) | 12 |
| Package Width (mm) | 10 |
| Package Height (mm) | 1.1 |
| Seated Plane Height (mm) | 1.7(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Mbit |
| Interface Type | Parallel|Serial |
| Maximum Operating Current | 50mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Timing Type | Asynchronous|Synchronous |
| Maximum Access Time | 55ns |
| Number of Words | 1M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 20bit |
| Location of Boot Block | Bottom |
| Number of Bits per Word | 32bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Micron M58BW032DB55ZA6T Datasheet
Download the complete datasheet for Micron M58BW032DB55ZA6T to view detailed technical specifications.
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