64M-bit NOR Flash memory with a 4M x 16 configuration, featuring a 1.8V operating voltage and 85ns maximum access time. This surface-mount component utilizes a Thin Fine Pitch Ball Grid Array (TFBGA) package, measuring 10mm x 6.5mm x 0.79mm with a 0.75mm pin pitch. It supports both parallel and serial interfaces, asymmetrical block organization, and includes a top-located boot block. Operating across a temperature range of -40°C to 85°C, it draws a maximum of 25mA.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron M58CR064P85ZB6T technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
56
PCB
56
Package Length (mm)
10
Package Width (mm)
6.5
Package Height (mm)
0.79
Seated Plane Height (mm)
0.79
Pin Pitch (mm)
0.75
Package Material
Plastic
Mounting
Surface Mount
Density
64Mbit
Interface Type
Parallel|Serial
Maximum Operating Current
25mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
1.8 to 2|11.4 to 12.6V
Timing Type
Asynchronous|Synchronous
Maximum Access Time
85ns
Number of Words
4M
Boot Block
Yes
Typical Operating Supply Voltage
1.8V
Address Bus Width
22bit
Location of Boot Block
Top
Number of Bits per Word
16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Micron M58CR064P85ZB6T Datasheet
Download the complete datasheet for Micron M58CR064P85ZB6T to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.