PackageVFBGA
MountingSurface Mount
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Technical Specifications
Micron M58LR256GL90ZC5E technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
VFBGA
Package Description
Very Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
44
PCB
44
Package Length (mm)
10
Package Width (mm)
8
Package Height (mm)
0.66
Seated Plane Height (mm)
0.66
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Micron M58LR256GL90ZC5E Datasheet
Download the complete datasheet for Micron M58LR256GL90ZC5E to view detailed technical specifications.
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