256M-bit NOR Flash memory with a parallel interface, featuring a 16M x 16 word organization and 24-bit address bus. This surface-mount component operates at a typical 1.8V supply voltage, with a maximum access time of 110ns. It is housed in a 64-pin Thin Profile Ball Grid Array (TBGA) package measuring 13mm x 10mm x 0.85mm, designed for a wide operating temperature range of -25°C to 85°C. The memory architecture is sectored with an asymmetrical block organization and includes a top boot block.
PackageTBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Micron M58LT256GT1ZA5 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TBGA
Package Description
Thin Profile Ball Grid Array
Lead Shape
Ball
Pin Count
64
PCB
64
Package Length (mm)
13
Package Width (mm)
10
Package Height (mm)
0.85(Max)
Seated Plane Height (mm)
0.85(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
256Mbit
Interface Type
Parallel
Maximum Operating Current
27mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
1.7 to 2|8.5 to 9.5V
Timing Type
Asynchronous|Synchronous
Maximum Access Time
110ns
Number of Words
16M
Boot Block
Yes
Typical Operating Supply Voltage
1.8V
Address Bus Width
24bit
Location of Boot Block
Top
Number of Bits per Word
16bit
Min Operating Temperature
-25°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Micron M58LT256GT1ZA5 Datasheet
Download the complete datasheet for Micron M58LT256GT1ZA5 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.