256M-bit NOR Flash memory with parallel and serial interfaces, featuring a 16M x 16 word organization and 24-bit address bus. This surface-mount component operates at 1.8V, offering an 85ns maximum access time and asynchronous/synchronous timing. Packaged in a 64-pin Thin Profile Ball Grid Array (TBGA) with a 1mm pitch, it supports asymmetrical block organization and includes a top boot block. Operating current is 27mA, with programming voltages ranging from 1.7-2V and 8.5-9.5V, across a temperature range of -40°C to 85°C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
Micron M58LT256JST8ZA6 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 13 |
| Package Width (mm) | 10 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 256Mbit |
| Interface Type | Parallel|Serial |
| Maximum Operating Current | 27mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 1.7 to 2|8.5 to 9.5V |
| Timing Type | Asynchronous|Synchronous |
| Maximum Access Time | 85ns |
| Number of Words | 16M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 1.8V |
| Address Bus Width | 24bit |
| Location of Boot Block | Top |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Micron M58LT256JST8ZA6 Datasheet
Download the complete datasheet for Micron M58LT256JST8ZA6 to view detailed technical specifications.
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