32M-bit NOR Flash memory with a parallel interface, featuring 2M x 16 organization and a 90ns maximum access time. This surface-mount component utilizes a Thin Profile Ball Grid Array (TBGA) package with 64 pins and a 1mm pin pitch. Operating from 2.7V to 3.6V, it offers a typical supply voltage of 3V or 3.3V and a maximum operating current of 30mA. The memory architecture is sectored with symmetrical block organization, supporting an address bus width of 21 bits and 16 bits per word. Operating temperature range is from -40°C to 85°C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
Micron M58LW032A90ZA6 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 13 |
| Package Width (mm) | 10 |
| Package Height (mm) | 0.85(Max) |
| Seated Plane Height (mm) | 0.85(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 30mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6V |
| Timing Type | Asynchronous|Synchronous |
| Maximum Access Time | 90ns |
| Number of Words | 2M |
| Boot Block | No |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 21bit |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micron M58LW032A90ZA6 Datasheet
Download the complete datasheet for Micron M58LW032A90ZA6 to view detailed technical specifications.
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