32M-bit NOR Flash memory with a parallel interface, offering 2M x 16 organization. Features a 110ns maximum access time and operates from 2.7V to 3.6V programming voltage, with typical supply voltages of 3V or 3.3V. Packaged in a 56-pin TSOP (Thin Small Outline Package) for surface mounting, this component utilizes a 21-bit address bus and 16-bit word width. Designed for a temperature range of 0°C to 70°C, it has a maximum operating current of 30mA.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron M58LW032C110N1F technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
56
PCB
56
Package Length (mm)
14
Package Width (mm)
18.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
32Mbit
Interface Type
Parallel
Maximum Operating Current
30mA
Block Organization
Symmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6V
Timing Type
Asynchronous|Synchronous
Maximum Access Time
110ns
Number of Words
2M
Boot Block
No
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
21bit
Number of Bits per Word
16bit
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Micron M58LW032C110N1F Datasheet
Download the complete datasheet for Micron M58LW032C110N1F to view detailed technical specifications.
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