32M-bit NOR Flash memory with a parallel interface, featuring a 2M x 16 configuration. This surface-mount component utilizes a 64-pin Thin Profile Ball Grid Array (TBGA) package measuring 13mm x 10mm x 0.8mm with a 1mm pin pitch. Operating at a typical 3.3V supply, it offers a maximum access time of 110ns and supports a programming voltage range of 2.7V to 3.6V. The memory architecture is sectored with symmetrical block organization, designed for operation between -40°C and 85°C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
Micron M58LW032C110ZA6F technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TBGA
Package Description
Thin Profile Ball Grid Array
Lead Shape
Ball
Pin Count
64
PCB
64
Package Length (mm)
13
Package Width (mm)
10
Package Height (mm)
0.8
Seated Plane Height (mm)
0.8
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
32Mbit
Interface Type
Parallel
Maximum Operating Current
30mA
Block Organization
Symmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6V
Timing Type
Asynchronous|Synchronous
Maximum Access Time
110ns
Number of Words
2M
Boot Block
No
Typical Operating Supply Voltage
3.3V
Address Bus Width
21bit
Number of Bits per Word
16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Micron M58LW032C110ZA6F Datasheet
Download the complete datasheet for Micron M58LW032C110ZA6F to view detailed technical specifications.
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