PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron M58LW032D110N6PF technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
56
PCB
56
Package Length (mm)
14
Package Width (mm)
18.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Micron M58LW032D110N6PF Datasheet
Download the complete datasheet for Micron M58LW032D110N6PF to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.