32M-bit NOR Flash memory with parallel interface, offering 4M x 8 or 2M x 16 organization. Features a 110ns maximum access time and operates from 2.7V to 3.6V programming voltage, with typical supply voltages of 3V or 3.3V. Packaged in a 64-pin Thin Profile Ball Grid Array (TBGA) with a 13mm x 10mm footprint and 0.85mm maximum height, designed for surface mounting. This component supports an address bus width of 22/21 bits and operates within a temperature range of 0°C to 70°C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
Micron M58LW032D110ZA1 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 13 |
| Package Width (mm) | 10 |
| Package Height (mm) | 0.85(Max) |
| Seated Plane Height (mm) | 0.85(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 20mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6V |
| Timing Type | Asynchronous |
| Maximum Access Time | 110ns |
| Number of Words | 4M/2M |
| Boot Block | No |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 22/21bit |
| Number of Bits per Word | 8/16bit |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | 6Y440 |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Micron M58LW032D110ZA1 Datasheet
Download the complete datasheet for Micron M58LW032D110ZA1 to view detailed technical specifications.
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