64M-bit NOR Flash memory with a parallel interface, featuring a 4M x 16 configuration and a 150ns maximum access time. This Thin Small Outline Package (TSOP) component operates from 2.7V to 3.6V programming voltage and supports 3V/3.3V supply voltages. Designed for surface mounting, it offers a 56-pin gull-wing lead-frame SMT package with a 0.5mm pin pitch. The memory architecture is sectored with boot block capability, suitable for operating temperatures between 0°C and 70°C.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron M58LW064A150N1T technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSOP |
| Package Description | Thin Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 56 |
| PCB | 56 |
| Package Length (mm) | 14 |
| Package Width (mm) | 18.4 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 64Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 50mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6V |
| Timing Type | Asynchronous|Synchronous |
| Maximum Access Time | 150ns |
| Number of Words | 4M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 22bit |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | 6Y440 |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micron M58LW064A150N1T Datasheet
Download the complete datasheet for Micron M58LW064A150N1T to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.