64M-bit NOR Flash memory with a parallel interface, featuring 4M words x 16 bits. This surface-mount component operates from 2.7V to 3.6V, with typical supply voltages of 3V or 3.3V, and offers a maximum access time of 150ns. The LBGA package, measuring 13mm x 10mm x 0.8mm with a 1mm pin pitch, contains 54 pins and supports boot block functionality. It is designed for a temperature range of -40°C to 85°C with a maximum operating current of 50mA.
PackageLBGA
MountingSurface Mount
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Technical Specifications
Micron M58LW064A150ZA6T technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
LBGA
Package Description
Low Profile Ball Grid Array
Lead Shape
Ball
Pin Count
54
PCB
54
Package Length (mm)
13
Package Width (mm)
10
Package Height (mm)
0.8
Seated Plane Height (mm)
0.8
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
64Mbit
Interface Type
Parallel
Maximum Operating Current
50mA
Block Organization
Symmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6V
Timing Type
Asynchronous|Synchronous
Maximum Access Time
150ns
Number of Words
4M
Boot Block
Yes
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
22bit
Number of Bits per Word
16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Micron M58LW064A150ZA6T Datasheet
Download the complete datasheet for Micron M58LW064A150ZA6T to view detailed technical specifications.
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