64M-bit NOR Flash memory with a parallel interface, featuring a 4M x 16 configuration. This surface-mount component operates at 3V/3.3V with a maximum access time of 110ns. Housed in a 64-pin Thin Profile Ball Grid Array (TBGA) package measuring 13mm x 10mm x 0.85mm, it offers a 22-bit address bus and 16-bit word width. Operating current is 30mA, with a temperature range of 0°C to 70°C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
Micron M58LW064C110ZA1 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TBGA
Package Description
Thin Profile Ball Grid Array
Lead Shape
Ball
Pin Count
64
PCB
64
Package Length (mm)
13
Package Width (mm)
10
Package Height (mm)
0.85(Max)
Seated Plane Height (mm)
0.85(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
64Mbit
Interface Type
Parallel
Maximum Operating Current
30mA
Block Organization
Symmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6V
Timing Type
Asynchronous|Synchronous
Maximum Access Time
110ns
Number of Words
4M
Boot Block
No
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
22bit
Number of Bits per Word
16bit
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron M58LW064C110ZA1 Datasheet
Download the complete datasheet for Micron M58LW064C110ZA1 to view detailed technical specifications.
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