64M-bit NOR Flash memory with a parallel interface, offering 4M x 16 organization. Features a 110ns maximum access time and operates from 2.7V to 3.6V programming voltage, with typical supply voltages of 3V/3.3V. Packaged in a 64-pin Thin Profile Ball Grid Array (TBGA) with a 13mm x 10mm footprint and 0.85mm maximum height, designed for surface mounting. This component utilizes a sectored architecture and has an address bus width of 22 bits.
PackageTBGA
MountingSurface Mount
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Technical Specifications
Micron M58LW064C110ZA1T technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TBGA
Package Description
Thin Profile Ball Grid Array
Lead Shape
Ball
Pin Count
64
PCB
64
Package Length (mm)
13
Package Width (mm)
10
Package Height (mm)
0.85(Max)
Seated Plane Height (mm)
0.85(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
64Mbit
Interface Type
Parallel
Maximum Operating Current
30mA
Block Organization
Symmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6V
Timing Type
Asynchronous|Synchronous
Maximum Access Time
110ns
Number of Words
4M
Boot Block
No
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
22bit
Number of Bits per Word
16bit
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Micron M58LW064C110ZA1T Datasheet
Download the complete datasheet for Micron M58LW064C110ZA1T to view detailed technical specifications.
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