128M-bit NOR Flash memory with a parallel interface, offering 8M x 16 words and a maximum access time of 115ns. Features a 56-pin VFBGA package with a 0.75mm pin pitch, designed for surface mounting. Operates from a 2.7V to 3.6V programming voltage, with a typical supply voltage of 3.3V and a maximum operating current of 30mA. Supports both asynchronous and synchronous timing, with a 23-bit address bus and sectored architecture. Suitable for operation across a temperature range of -40°C to 85°C.
PackageVFBGA
MountingSurface Mount
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Technical Specifications
Micron M58LW128H115ZB6 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | VFBGA |
| Package Description | Very Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 56 |
| PCB | 56 |
| Package Length (mm) | 11 |
| Package Width (mm) | 9 |
| Package Height (mm) | 0.66 |
| Seated Plane Height (mm) | 0.66 |
| Pin Pitch (mm) | 0.75 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 128Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 30mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6V |
| Timing Type | Asynchronous|Synchronous |
| Maximum Access Time | 115ns |
| Number of Words | 8M |
| Boot Block | No |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 23bit |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Micron M58LW128H115ZB6 Datasheet
Download the complete datasheet for Micron M58LW128H115ZB6 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.