16M-bit NOR Flash memory with a 1M x 16 configuration, featuring a 1.8V typical operating supply voltage and 100ns maximum access time. This integrated circuit offers a parallel interface and is housed in a 48-pin Thin Fine Pitch Ball Grid Array (TFBGA) package with a 0.5mm pin pitch. It supports both asynchronous and synchronous timing, with a 20-bit address bus and 16-bit word width, and includes a bottom boot block. Operating across a -40°C to 85°C temperature range, this surface-mount component draws a maximum operating current of 30mA.
Micron M58MR016D100ZC6T technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 10.53 |
| Package Width (mm) | 6.29 |
| Package Height (mm) | 0.79 |
| Seated Plane Height (mm) | 0.79 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 16Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 30mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 1.7 to 2|11.4 to 12.6V |
| Timing Type | Asynchronous|Synchronous |
| Maximum Access Time | 100ns |
| Number of Words | 1M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 1.8V |
| Address Bus Width | 20bit |
| Location of Boot Block | Bottom |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 6Y440 |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for Micron M58MR016D100ZC6T to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.