PackageVFBGA
MountingSurface Mount
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Technical Specifications
Micron M58WR128EB70ZB6T technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
VFBGA
Package Description
Very Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
60
PCB
60
Package Length (mm)
12.5
Package Width (mm)
12
Package Height (mm)
0.66
Mounting
Surface Mount
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Micron M58WR128EB70ZB6T Datasheet
Download the complete datasheet for Micron M58WR128EB70ZB6T to view detailed technical specifications.
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