PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron M59DR032EA85ZF1F technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
48
PCB
48
Package Length (mm)
7
Package Width (mm)
7
Package Height (mm)
0.8
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.75
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Micron M59DR032EA85ZF1F Datasheet
Download the complete datasheet for Micron M59DR032EA85ZF1F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.