PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron MT29F16G08CBABAWP:B technical specifications.
General
Package/Case
TSOP
Density
16Gb
Max Operating Temperature
70°C
Memory Size
2000000000B
Memory Type
MLC NAND,
Min Operating Temperature
0°C
Mount
Surface Mount
Operating Supply Voltage
3.3V
Packaging
Tray
Radiation Hardening
No
Word Size
16b
Compliance
RoHS
Compliant
Datasheet
Micron MT29F16G08CBABAWP:B Datasheet
Download the complete datasheet for Micron MT29F16G08CBABAWP:B to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.