PackageVFBGA
MountingSurface Mount
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Technical Specifications
Micron MT29F1G16ABCHC-ET:C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
VFBGA
Package Description
Very Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
63
PCB
63
Package Material
Plastic
Mounting
Surface Mount
Density
1Gbit
Interface Type
Serial
Maximum Operating Current
20mA
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Synchronous
Maximum Access Time
30ns
Number of Words
64M
Boot Block
No
Typical Operating Supply Voltage
1.8V
Address Bus Width
27bit
Number of Bits per Word
16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Micron MT29F1G16ABCHC-ET:C Datasheet
Download the complete datasheet for Micron MT29F1G16ABCHC-ET:C to view detailed technical specifications.
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