PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron MT29F64G08CFAAAWC:A technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Material
Plastic
Mounting
Surface Mount
Density
64Gbit
Interface Type
Parallel
Timing Type
Asynchronous
Number of Words
8G
Boot Block
No
Typical Operating Supply Voltage
3.3V
Number of Bits per Word
8bit
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron MT29F64G08CFAAAWC:A Datasheet
Download the complete datasheet for Micron MT29F64G08CFAAAWC:A to view detailed technical specifications.
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