256Mbit RLDRAM memory chip, organized as 8Mx32, features a 32-bit data bus and a maximum clock rate of 300 MHz. This surface-mount component utilizes an 144-pin UBGA package with a 1.8V typical operating supply voltage. It offers 8 internal banks, each with 1M words, and operates within a temperature range of 0°C to 95°C.
PackageUBGA
MountingSurface Mount
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Technical Specifications
Micron MT49H8M32FM-33 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
UBGA
Package Description
Ultra Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
144
PCB
144
Package Length (mm)
18.5
Package Width (mm)
11
Package Height (mm)
0.7
Seated Plane Height (mm)
1.09
Package Material
Plastic
Mounting
Surface Mount
Density
256Mbit
Type
RLDRAM
Organization
8Mx32
Data Bus Width
32bit
Maximum Clock Rate
300MHz
Number of Internal Banks
8
Number of Words per Bank
1M
Density in Bits
268435456bit
Address Bus Width
22bit
Maximum Operating Current
723mA
Typical Operating Supply Voltage
1.8V
Max Operating Supply Voltage
1.95V
Min Operating Supply Voltage
1.7V
Min Operating Temperature
0°C
Max Operating Temperature
95°C
Compliance
Cage Code
6Y440
EU RoHS
Yes with Exemption
HTS Code
8542320024
Schedule B
8542320015
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Micron MT49H8M32FM-33 Datasheet
Download the complete datasheet for Micron MT49H8M32FM-33 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.