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Technical Specifications
Micron MTFC32GJVED-3M WT technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WFBGA |
| Lead Shape | Ball |
| Pin Count | 169 |
| PCB | 169 |
| Package Length (mm) | 18 |
| Package Width (mm) | 14 |
| Package Height (mm) | 0.43(Min) |
| Seated Plane Height (mm) | 0.7 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 256Gbit |
| Interface Type | Serial e-MMC |
| Architecture | Sectored |
| Timing Type | Synchronous |
| Number of Words | 256G/64G/32G |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3.3V |
| Number of Bits per Word | 1/4/8bit |
| Min Operating Temperature | -25°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Micron MTFC32GJVED-3M WT Datasheet
Download the complete datasheet for Micron MTFC32GJVED-3M WT to view detailed technical specifications.
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