Micron
MTFC8GLVEA-1M WT
Managed NAND Flash Serial e-MMC 3.3V 64G-bit 64G/16G/8G x 1/4-bit/8-bit 153-Pin WFBGA
PackageWFBGA
MountingSurface Mount
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Technical Specifications
Micron MTFC8GLVEA-1M WT technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WFBGA
Lead Shape
Ball
Pin Count
153
PCB
153
Package Length (mm)
13
Package Width (mm)
11.5
Package Height (mm)
0.43(Min)
Seated Plane Height (mm)
0.7
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
64Gbit
Interface Type
Serial e-MMC
Architecture
Sectored
Timing Type
Synchronous
Number of Words
64G/16G/8G
Boot Block
Yes
Typical Operating Supply Voltage
3.3V
Number of Bits per Word
1/4/8bit
Min Operating Temperature
-25°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Micron MTFC8GLVEA-1M WT Datasheet
Download the complete datasheet for Micron MTFC8GLVEA-1M WT to view detailed technical specifications.
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