256M-bit NOR Flash memory with Serial (SPI, Dual SPI, Quad SPI) interface, supporting 3V/3.3V operation. Features 32M x 4-bit architecture, 8ns maximum access time, and a 24-pin TFBGA package (8mm x 6mm x 0.79mm) for surface mounting. Operates across a wide temperature range of -40°C to 125°C, with programming voltages from 2.7V to 3.6V and 8.5V to 9.5V. Includes boot block functionality with configurable location (bottom/top).
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron N25Q256A13E12A0F technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Profile Ball Grid Array
Lead Shape
Ball
Pin Count
24
PCB
24
Package Length (mm)
8
Package Width (mm)
6
Package Height (mm)
0.79
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
256Mbit
Interface Type
Serial (SPI, Dual SPI, Quad SPI)
Maximum Operating Current
20mA
Block Organization
Symmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6|8.5 to 9.5V
Timing Type
Synchronous
Maximum Access Time
8ns
Number of Words
32M
Boot Block
Yes
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
32bit
Location of Boot Block
Bottom|Top
Number of Bits per Word
4bit
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron N25Q256A13E12A0F Datasheet
Download the complete datasheet for Micron N25Q256A13E12A0F to view detailed technical specifications.
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