256M-bit NOR Flash memory with Serial (SPI, Dual SPI, Quad SPI) interface. Features 3V/3.3V operation, 8ns maximum access time, and a 16-pin SOIC W surface-mount package. Offers 32M x 4-bit organization, sectored architecture, and supports boot block functionality. Operates across a -40°C to 85°C temperature range.
PackageSOIC W
MountingSurface Mount
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Technical Specifications
Micron N25Q256A13ESFH0E technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC W
Package Description
Small Outline Package (Type II)
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
10.3
Package Width (mm)
7.5
Package Height (mm)
2.3
Seated Plane Height (mm)
2.5
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Density
256Mbit
Interface Type
Serial (SPI, Dual SPI, Quad SPI)
Maximum Operating Current
20mA
Block Organization
Symmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6|8.5 to 9.5V
Timing Type
Synchronous
Maximum Access Time
8ns
Number of Words
32M
Boot Block
Yes
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
32bit
Location of Boot Block
Bottom|Top
Number of Bits per Word
4bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Datasheet
Micron N25Q256A13ESFH0E Datasheet
Download the complete datasheet for Micron N25Q256A13ESFH0E to view detailed technical specifications.
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