2G-bit NAND Flash memory with a parallel interface, featuring 256M x 8 organization and a 29-bit address bus. This Thin Small Outline Package (TSOP) component operates at 1.8V, offering a maximum access time of 25,000 ns and a maximum operating current of 15 mA. Designed for surface mounting, it utilizes a lead-frame SMT package with 48 gull-wing leads on a 0.5mm pitch, measuring 12mm x 18.4mm x 1mm. The memory architecture is sectored and asynchronous, suitable for operation within a 0°C to 70°C temperature range.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron NAND02GR3B2BN1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12
Package Width (mm)
18.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
2Gbit
Interface Type
Parallel
Maximum Operating Current
15mA
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Asynchronous
Maximum Access Time
25000ns
Number of Words
256M
Boot Block
No
Typical Operating Supply Voltage
1.8V
Address Bus Width
29bit
Number of Bits per Word
8bit
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron NAND02GR3B2BN1 Datasheet
Download the complete datasheet for Micron NAND02GR3B2BN1 to view detailed technical specifications.
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