4G-bit parallel NAND Flash memory, organized as 512M x 8 words, operates at 3.3V with a maximum access time of 25µs. This surface-mount component features a 63-pin Thin Fine Pitch Ball Grid Array (TFBGA) package measuring 12mm x 9.5mm x 0.8mm. The memory utilizes a symmetrical, sectored architecture and has an address bus width of 30 bits. Operating current is a maximum of 30mA, with an operating temperature range of 0°C to 70°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron NAND04GW3B2CZB1E technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
63
PCB
63
Package Length (mm)
12
Package Width (mm)
9.5
Package Height (mm)
0.8
Seated Plane Height (mm)
1.2(Max)
Package Material
Plastic
Mounting
Surface Mount
Density
4Gbit
Interface Type
Parallel
Maximum Operating Current
30mA
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Asynchronous
Maximum Access Time
25000ns
Number of Words
512M
Boot Block
No
Typical Operating Supply Voltage
3.3V
Address Bus Width
30bit
Number of Bits per Word
8bit
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Micron NAND04GW3B2CZB1E Datasheet
Download the complete datasheet for Micron NAND04GW3B2CZB1E to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.