8G-bit parallel NAND Flash memory, 1G x 8 organization, featuring a 1.8V operating voltage and 25µs access time. This Thin Small Outline Package (TSOP) component offers a 48-pin lead-frame SMT interface with a 0.5mm pin pitch. Designed for surface mounting, it operates within a 0°C to 70°C temperature range and has a maximum operating current of 15mA.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron NAND08GR3B2AN1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12
Package Width (mm)
18.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
8Gbit
Interface Type
Parallel
Maximum Operating Current
15mA
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Asynchronous
Maximum Access Time
25000ns
Number of Words
1G
Boot Block
No
Typical Operating Supply Voltage
1.8V
Address Bus Width
31bit
Number of Bits per Word
8bit
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron NAND08GR3B2AN1 Datasheet
Download the complete datasheet for Micron NAND08GR3B2AN1 to view detailed technical specifications.
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