8G-bit Parallel NAND Flash memory, featuring a 512M x 16 word organization and 30-bit address bus. This Thin Small Outline Package (TSOP) component offers a 3V/3.3V operating supply voltage and a 48-pin gull-wing lead configuration for surface mounting. It operates with asynchronous timing, providing a maximum access time of 25µs, and supports a maximum operating current of 30mA. Designed for a temperature range of -40°C to 85°C, this plastic packaged memory utilizes a symmetrical, sectored block architecture.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron NAND08GW4B2CN6 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12
Package Width (mm)
18.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
8Gbit
Interface Type
Parallel
Maximum Operating Current
30mA
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Asynchronous
Maximum Access Time
25000ns
Number of Words
512M
Boot Block
No
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
30bit
Number of Bits per Word
16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron NAND08GW4B2CN6 Datasheet
Download the complete datasheet for Micron NAND08GW4B2CN6 to view detailed technical specifications.
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