256M-bit SLC NAND Flash memory with a parallel interface, featuring 32M x 8 word organization. This Thin Small Outline Package (TSOP) component offers a 48-pin gull-wing lead shape for surface mounting, operating at 3V or 3.3V with a maximum access time of 12µs. The symmetrical, sectored block architecture supports a 27-bit address bus and an 8-bit data bus, with a maximum operating current of 20mA. Designed for a temperature range of 0°C to 70°C, it is housed in a plastic, lead-frame SMT package.
Micron NAND256W3A0AN1E technical specifications.
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