256M-bit SLC NAND Flash memory, featuring a parallel interface and 3V/3.3V operation. This component offers 32M words with an 8-bit data bus width and a 27-bit address bus. It utilizes a symmetrical, sectored architecture with asynchronous timing and a maximum access time of 12,000 ns. The device is housed in a 55-pin TFBGA package, measuring 10mm x 8mm x 0.8mm, designed for surface mounting. Operating current is a maximum of 20 mA, with an operating temperature range of 0°C to 70°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron NAND256W3A2BZB1 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
55
PCB
55
Package Length (mm)
10
Package Width (mm)
8
Package Height (mm)
0.8
Seated Plane Height (mm)
1.2(Max)
Package Material
Plastic
Mounting
Surface Mount
Density
256Mbit
Interface Type
Parallel
Maximum Operating Current
20mA
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Asynchronous
Maximum Access Time
12000ns
Number of Words
32M
Boot Block
No
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
27bit
Number of Bits per Word
8bit
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron NAND256W3A2BZB1 Datasheet
Download the complete datasheet for Micron NAND256W3A2BZB1 to view detailed technical specifications.
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