256M-bit SLC NAND Flash memory with a parallel interface, featuring 16M words x 16 bits. This surface-mount component operates at 3V/3.3V and offers a maximum access time of 12µs. Housed in a 55-pin Thin Fine Pitch Ball Grid Array (TFBGA) package measuring 10mm x 8mm x 0.8mm, it supports a 26-bit address bus and has a maximum operating current of 20mA. Operating temperature range is -40°C to 85°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron NAND256W4A2BZB6F technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
55
PCB
55
Package Length (mm)
10
Package Width (mm)
8
Package Height (mm)
0.8
Seated Plane Height (mm)
1.2(Max)
Package Material
Plastic
Mounting
Surface Mount
Density
256Mbit
Interface Type
Parallel
Maximum Operating Current
20mA
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Asynchronous
Maximum Access Time
12000ns
Number of Words
16M
Boot Block
No
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
26bit
Number of Bits per Word
16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Micron NAND256W4A2BZB6F Datasheet
Download the complete datasheet for Micron NAND256W4A2BZB6F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.