512M-bit SLC NAND Flash memory with a parallel interface, featuring a 64M x 8 configuration. This Thin Small Outline Package (TSOP) component operates at 1.8V with a maximum access time of 15µs and a maximum operating current of 15mA. It is designed for surface mounting with 48 gull-wing leads on a 0.5mm pitch, housed in a plastic package measuring 12mm x 18.4mm x 1mm. Operating temperature range is -40°C to 85°C.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron NAND512R3A2BN6E technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12
Package Width (mm)
18.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
512Mbit
Interface Type
Parallel
Maximum Operating Current
15mA
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Asynchronous
Maximum Access Time
15000ns
Number of Words
64M
Boot Block
No
Typical Operating Supply Voltage
1.8V
Address Bus Width
27bit
Number of Bits per Word
8bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron NAND512R3A2BN6E Datasheet
Download the complete datasheet for Micron NAND512R3A2BN6E to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.