512M-bit SLC NAND Flash memory, featuring a parallel interface and 1.8V operating voltage. This Very Thin Fine Pitch Ball Grid Array (VFBGA) component offers a 63-pin configuration with a 0.8mm pitch, designed for surface mounting. It boasts a 64M x 8 word organization, 27-bit address bus, and a maximum access time of 15µs. Operating within a temperature range of -40°C to 85°C, this plastic-encased IC draws a maximum of 15mA.
PackageVFBGA
MountingSurface Mount
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Technical Specifications
Micron NAND512R3A2BZA6F technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
VFBGA
Package Description
Very Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
63
PCB
63
Package Length (mm)
11
Package Width (mm)
9
Package Height (mm)
0.7(Max)
Seated Plane Height (mm)
0.7(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
512Mbit
Interface Type
Parallel
Maximum Operating Current
15mA
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Asynchronous
Maximum Access Time
15000ns
Number of Words
64M
Boot Block
No
Typical Operating Supply Voltage
1.8V
Address Bus Width
27bit
Number of Bits per Word
8bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron NAND512R3A2BZA6F Datasheet
Download the complete datasheet for Micron NAND512R3A2BZA6F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.