PackageTFBGA
Voltage3.3V
MountingSurface Mount
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Technical Specifications
Micron NAND512R3A2SZA6F technical specifications.
General
Access Time
50ns
Address Bus Width
26b
Package/Case
TFBGA
Density
512Mb
Interface
Parallel
Max Operating Temperature
85°C
Memory Size
512Mb
Memory Type
Non-Volatile, , FLASH, SLC NAND
Min Operating Temperature
-40°C
Mount
Surface Mount
Operating Supply Voltage
1.8V
Packaging
Bulk
Page Size
512B
Radiation Hardening
No
RoHS Compliant
Yes
Voltage
3.3V
DC Rated Voltage
3.3V
Compliance
RoHS
Compliant
Datasheet
Micron NAND512R3A2SZA6F Datasheet
Download the complete datasheet for Micron NAND512R3A2SZA6F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.